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ELECTROCHEMICAL MODEL OF FAILURES OF INSULATION STRUCTURES FROM COMPOSITE MATERIALS
Razorenov Aleksandr Gennadievich, engineer, director, Research Institute of Innovative Technologies (121467, build 2, 5 Moldavskaja street, Moscow, Russia), AlexOst1991@mail.ru
One of the causes of failures of equipment based on the printed circuit board, made of composite materials with high density interconnections is determined by the electrochemical process of formation of metal bridges on capillary channels along the layers of laminated plastics under conditions of high humidity and constant voltage. This phenomenon is characteristic for low current avionics equipment and little studied. This study was carried out in relation to the insulating substrates of PCB from composite materials. Analysis of defects of electrical design multi-layer printed circuit board (WFP). The influence of electrochemical processes in the composite structure of WFP. Stressed that the mikropolosti are the main source of isolation failures by WFP. Proposed measures for preventing failures isolation of printed circuit boards. that even a small number of defects, presence of dielectric between layers of hygroscopic or grease (in particular, from the surface of human skin.
avionics, circuit boards, composite materials, electrochemical failure, reliability, electrical insulation degradation.
Дата обновления: 29.09.2016 15:27